英飞凌拟联合英特尔开发手机SIM芯 09年量产

2007-11-14 08:23:25 赛迪网【大中小】发表评论

    11月14日消息，据外电报道，德国半导体巨头英飞凌周二宣布，它将与美国的英特尔联合开发用于手机的SIM（用户身份模块）芯片。

    英飞凌称，它将提供用于每个SIM卡的微型芯片。大批量生产预计将从2009年年初开始。

    英飞凌没有披露有关这个合资企业的金融细节。但是，英飞凌表示，到2008年年末，新的SIM卡的USB接口能够满足额外的需求，实现数据密集型的移动应用、服务和空中下载。

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SIM芯

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